Introduction

Since 1972 Lap Tech has produced custom quartz resonators. The experience gained in the lapping and polishing of quartz is now being made available to industry in general.
From the smallest crystalline substrates to various metal items and correcting of allumina plates, Lap Tech can provide a very wide range of lapping and polishing services.

Methods

Unlike most optical fabricators that rely solely on single side processing, our facility can process very small thin sections to large items using single or double side processing.
Our experience is primarily very flat and parallel quartz substrates for frequency control but also encompasses metal and ceramic processing to the same exacting tolerances.

 

Precision Ceramic Chuck Reconditioning Service.

Chucks designed to support silicon wafers during the polishing process, eventually wear reducing the overall quality of the Silicon wafers. Laptech can recondition plates of Aluminum Oxide or Silicon carbide using a propriety lapping technique, returning the plates clean and ready for use.

Current capability:
Diameters up to 750 mm
Profiles from dead flat to 10 microns concave or convex.
Undulation +/- 100nM
Edge Fade -100nM in 5 mm
Roughness depends on material quality but in the range
of 350 – 750 Ra.

 

General Lapping & Polishing Capabilities

After

Before

 

Lap – Tech Finesse 4 Way Lapper’s
Up to 250mm diameter
Thickness tolerance +/- 1 micron

Fujikoshi 20B Lapper
Up to 300 mm Size
Minimum thickness 1mm

Lap – Tech Finesse
Up to 6” diameter
Parallelism approximately 1 light band per inch.

Siltec
Up to 8” diameter
Thickness Range 0.4mm – 10 mm

Other Services Include:

Rounding / Surface Grinding / Wafering /Etching / Dicing / X-Ray Goniometry.

For a quote or engineering consultation email your requirement to:

Bob Parkins 905 623 4101

bparkins@laptech.com

Double Sided Polishing
Single Sided Polishing
Double Sided Lapping

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